Samsung Electronics' sixth-generation high-bandwidth memory (HBM4), delivered to Nvidia in July 2025, has reportedly cleared reliability testing, positioning it for pre-production by late August. The milestone is viewed as a concrete result of Samsung chairman Lee Jae-yong's recent meeting with Nvidia CEO Jensen Huang.

A new report claims that Nvidia might be winding down production of the China-only HGX H20 AI chip following claims that the chips is "unsafe" according to China's CAC.

Samsung reportedly offered NVIDIA its 12-layer HBM3E memory at 20-30% cheaper than SK hynix for use on its made-for-China H20 AI GPU.

Nvidia CEO Jensen Huang touched down in Taipei on Friday to meet with Taiwan Semiconductor Manufacturing Company (TSMC), the key builder behind the company’s most advanced chips. The visit was brief but timed right before Nvidia’s upcoming earnings report next Wednesday.

Driven by the booming demand for artificial intelligence (AI) servers, high-bandwidth memory (HBM) has become a key factor reshaping the memory industry landscape. Micron recently announced that its entire HBM supply for 2026 is already fully booked,

Nvidia Corp. ordenó a sus proveedores de componentes, entre los que se incluyen Samsung Electronics Co. y Amkor Technology Inc., que detengan la producción relacionada con el chip H20 AI, según informó The Information citando fuentes no identificadas.

Samsung's new HBM4 memory samples sent to NVIDIA have reportedly passed their tests, with mass production now imminent to fight SK hynix and Micron.

The AI chip market is expected to stay under Nvidia's dominance in 2026, as Samsung Electronics, SK Hynix, and Micron battle to win sixth-generation high-bandwidth memory (HBM4) orders. Efforts by hyperscalers to lessen dependence on Nvidia have so far fallen short,