Huawei CEO Ren Zhengfei during an interview in Taiyuan, Shanxi province, China, Feb. 9, 2021. Huawei, the Chinese tech giant, has borne the brunt of U.S. restrictions since 2019, when Washington ...

As demand for faster, smaller, and more energy-efficient electronics intensifies, advanced packaging has emerged as a critical enabler of progress in the semiconductor industry. By integrating ...

This article was originally published on ARPU. View the original post here. In a prominently placed interview with China's state newspaper, Huawei founder Ren Zhengfei sent a clear message to ...

This TechXchange examines chip packaging technology including new advances such as chiplets. Check out the video series on chip packaging. Packaging: A 30-Year Career Retrospective We’ve come a very ...

The chip manufacturing industry can be quite complex, and that’s normal. After all, there are multiple factors that go into the performance of a SoC, making it a success or directly ruining a good ...

Average Al chip-package size to triple by 2030 for more memory and computing cores Advanced packaging is becoming a core driver of semiconductor performance and profitability as artificial ...

ASE has announced a significant upgrade to its in-house integrated design ecosystem (IDE) platform, introducing IDE 2.0, which features AI integration to speed up design iterations and optimize ...

Forbes contributors publish independent expert analyses and insights. Dave Altavilla is a Tech Analyst covering chips, compute and AI. In a joint announcement reflecting the growing importance of ...

ALBANY, N.Y. — Gov. Kathy Hochul announced that GlobalFoundries (GF), a leading manufacturer of semiconductors located in Saratoga County, will invest $575 million to create a new center for advanced ...

Huawei, the Chinese tech giant, has borne the brunt of U.S. restrictions since 2019, when Washington barred it from acquiring advanced components. Export controls passed in 2022 further constrained ...