Ixys Corp. Wednesday introduced its direct aluminum bonded (DAB) substrate technology, which it says is more advanced than direct copper bonded (DCB) technology used for the production of integrated ...
Temperature-resistant AMB substrate for more compact power converters: The copper layer is brazed to the ceramic substrate. © M. Haller - Elektronik automotive The ...
As integration and switching rates increase rapidly, the concentration of heat losses is similarly changing. The continuous trend to shrink die size steadily increases the amount of heat to be ...
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