Yahoo Finance

Interconnect Modeling Technical Advisory Board Announces Electromigration Rules Now Part of the Open-Source ITF Standard

PISCATAWAY, NJ--(Marketwired - Apr 30, 2014) - The Interconnect Modeling Technical Advisory Board (IMTAB), an IEEE-ISTO Federation Member Program, today announced the incorporation of new ...
nsf.gov

SHF: Small: Physics-Based Electromigration Assessment and Validation For Reliability-Aware Design and Management

Long-term reliability has become a significant challenge for design of integrated circuit (IC) chips used in today's computers and smart phones. Among many effects, electromigration-induced ...
EDN

Electromigration protection requires accurate interconnect modeling

Electromigration (EM) refers to the undesired migration of metal atoms along a metal interconnect. This migration occurs due to the “electron wind” (which is the momentum transfer created by electrons ...
TechRepublic

Electromigration Modeling and Full-Chip Reliability Analysis for BEOL Interconnect in TSV-Based 3D ICs

Electro-Migration (EM) is a critical problem for interconnect reliability of modern Integrated Circuits (ICs), especially as the feature size becomes smaller. In Three-Dimensional (3D) IC technology, ...