One of the most cutting-edge packaging technologies to recently emerge in the electronics marketplace is the quad flat no leads (QFN)-type package. It serves as an alternative to the more costly ...

Dublin, July 29, 2025 (GLOBE NEWSWIRE) -- The "eFuse Market by Type, Packaging Type, Application, Vertical, and Region - Global Forecast to 2030" has been added to ResearchAndMarkets.com's offering.

Rising demand for chips is hitting the IC packaging supply chain, causing shortages of select manufacturing capacity, various package types, leadframes and even some equipment. Spot shortages for some ...

The relentless pursuit of performance in sectors such as AI, cloud computing, and autonomous driving is creating a heat crisis. As the next generation of processors demand more power in smaller spaces ...

Intelligent power module (IPM) in a high efficiency, ultra-compact, highly integrated QFN package saves energy when driving motors up to 200W. With over 200 million motors produced every year with ...