TODAY'S CUTTING EDGE INTEGRATED CIRCUITS DISSIPATE SUBSTANTIALLY HEAVIER LOADS OF HEAT THAN EVER BEFORE. At the same time, the premium associated with miniaturized applications has never been greater, ...

Before reviewing the heat-sink types, realize that many factors influence a heat sink's performance. These factors include upstream heating and flow blockage due to upstream components, contact area ...

Thinner fins employed in ultra-high ratio extrusion heat sinks for power semiconductors provide more surface area per unit width, at lower cost than their predecessors. Also, they reduce air flow back ...

In recent years, increases in processing power mean advanced semiconductor devices now dissipate astounding levels of power. For many applications, cooling these devices has become a major challenge.

Electronic devices, including those in telecommunications and high-power systems, generate heat during normal operation. That heat must be dissipated to avoid junction temperatures exceeding tolerable ...