Enhancing power density inevitably means dealing with heat. Fortunately, advances in material sciences, especially thermal ...
Using advanced techniques, researchers more-accurately characterized the thermal conductivity of four distinct GaN substrate types along with their defect density, and developed a formula linking the ...
Recent research into the properties of graphene nanoribbons provides two new reasons for using the material as interconnects in future computer chips. In widths as narrow as 16 nanometers, graphene ...
Copyright AD-TECH; licensee AZoM.com Pty Ltd. This is an AZo Open Access Rewards System (AZo-OARS) article distributed under the terms of the AZo–OARS https://www ...
Polymers are composed of very large molecules formed by a combination of different monomers (smaller and simpler molecules), which can be natural or synthetic. Polymers are the basis of many ...
A research team from Aarhus University, Denmark, has measured and explained the exceptionally low thermal conductivity of the crystalline material AgGaGe 3 Se 8. Despite its ordered structure, the ...
What do you think the biggest problem in CPU design is, right now? If you said "thermal density", you win today's prize. You don't actually get anything but our admiration and some well-deserved ...
eGaN FETs and ICs enable very high-density power converter design, owing to their compact size, ultra-fast switching, and low on-resistance. The limiting factor for output power in most high-density ...
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