Calculating the junction temperature for most semiconductor devices is a well known process. Typically, the case or lead temperature is known. The power dissipation of the die is measured and ...
This application note discusses the measurement process and the report of the thermal performance of a small outline SO-5 package. This process used a low conductivity test boards as per JEDEC ...
SAE International Journal of Alternative Powertrains, Vol. 6, No. 1 (May 2017), pp. 34-46 (13 pages) ABSTRACT In this paper, an improved analytical model accounting for thermal effects in the ...
As electrons whiz around the nanosized circuits inside computer chips, they generate a lot of heat. And that waste heat creates a major headache for the electronics industry. It shortens the lifespan ...
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