Advanced Micro Devices shines in AI with GPU synergies and flexible chip designs, challenging Nvidia's lead. Click here to ...

There are a lot of options out there, but picking an AMD graphics card makes a lot of sense, especially if you don’t want to fork over a lot of extra money for gimmicky extras. All of AMD’s ...

The down side to AMD’s 3D V-Cache implementation back then was that it was placed directly on top of the cores, or Core Chiplet Die (CCD). This hindered cooling as the cache sat between the hot ...

If you buy something from a Verge link, Vox Media may earn a commission. See our ethics statement. Tom Warren is a senior editor and author of Notepad, who has been covering all things Microsoft ...

Even three years later, AMD's high-end X3D-series processors still ... In the 9800X3D, you just have one CPU chiplet, and the 64MB of 3D V-Cache is stacked underneath. For the 9900X3D and 9950X3D ...

That's come about due to how AMD now bonds the 3D V-Cache slice to its CCDs. Previously, the extra L3 cache was bonded to the top of the chiplet and while that was relatively easy to implement ...

The story of the AMD Ryzen 9 9950X3D is refreshingly straightforward: it is as fast as the chart-leading Ryzen 7 9800X3D in games but has double the cores, so it's significantly better in content ...

Amazon is the one-stop shop for just about everything, including AMD GPUs. Unfortunately, manually looking for one of these GPUs on Amazon's site is quite difficult. Amazon doesn't have a general ...

A recent rumour is currently pointing to the possibility of AMD’s upcoming Zen 6 ... and are used in both Ryzen and EPYC SKUs – should come with 12 cores and 48MB of L3 Cache. In other words, a ...

Désiré has been musing and writing about technology during a career spanning four decades. He dabbled in website builders and web hosting when DHTML and frames were in vogue and started ...

AMD’s upcoming Zen 6 desktop CPUs are rolling out a new chiplet‑based design that pushes the envelope on core counts and efficiency. With these processors, you’re looking at a shift from ...

Another future trend predicted by IDTechEx is advanced 3D stacking, whereby interconnectivity and thermal management can be improved Smaller and more compact designs with simplified structures can be ...