This paper investigates substrate trace crack in board level Power Thermal Cycling (PTC) test with underfill between package and PCB. Effect of underfill is evaluated by comparing substrate material ...

Engineers also demonstrated that the material remains highly conductive and can recover its electrical function after being ...

The 4709A strain gauge amplifier from Kistler features a 24-bit ADC resolution and an 8 kSps sampling rate, enabling it to ...