This paper investigates substrate trace crack in board level Power Thermal Cycling (PTC) test with underfill between package and PCB. Effect of underfill is evaluated by comparing substrate material ...

The 4709A strain gauge amplifier from Kistler features a 24-bit ADC resolution and an 8 kSps sampling rate, enabling it to ...

FieldDAQ modules accept sensors directly and send data over Ethernet. Collecting data such as temperature, strain, and other ...

If PCBs aren’t tested, errors and defects missed during the manufacturing process could eventually lead to malfunctions and product failures in the field. After a PCB board is manufactured and ...