MicroCloud Hologram Inc. (NASDAQ: HOLO), ("HOLO" or the "Company"), a technology service provider, launched a brand-new scalable quantum Fourier transform simulator technology based on multi-FPGA and ...

MicroCloud Hologram Inc. (NASDAQ: HOLO), ("HOLO" or the "Company"), a technology service provider, released learnable quantum spectral filter technology for hybrid graph neural networks. This ...

From historic homes in Edinburgh to towering skyscrapers in Shanghai, you can now explore every building in the world from the comfort of your home. An incredible new map charts the location and size ...

Several non-biotech healthcare stocks are starting to show real momentum, breaking out of bases and asserting themselves as leaders in the sector. With improving volume patterns, accelerating relative ...

Breakthroughs, discoveries, and DIY tips sent every weekday. Terms of Service and Privacy Policy. Since 3D printers debuted in the 1980s, the devices have been used ...

Stock market graphs don’t have to be a mystery. Here’s how to read stock charts for any company. Many, or all, of the products featured on this page are from our advertising partners who compensate us ...

The song has been streamed over 3 million times in under a month. A song created through artificial intelligence has made history topping a Billboard country music chart, but it has also sent ...

Elliott Hill is trying to regain Nike’s NKE1.55%increase; green up pointing triangle lead in the innovation race—and its chunkiest running shoe ever might be the model for getting there, he said. With ...

The Trump administration says the new $100,000 fee for H-1B visas will help U.S. workers. Immigration lawyer LaToya McBean Pompy and law professor Bill Ong Hing discuss the impact. Photo Illustration: ...

Horizontal runout distance prediction of potential landslides is of great significance in hazard mitigation.In this study, predictive charts of landslide horizontal runout distance were developed ...

Inter-Die Gapfill Tool Expands Industry-Leading Portfolio of Solutions for 3D Integration and Chiplet Technologies; Paves Way for New, AI-Accelerating Architectures Addresses Manufacturing Pain ...

A new technical paper titled “In Situ Atomic-Scale Investigation of Electromigration Behavior in Cu–Cu Joints at High Current Density” was published by researchers at National Yang Ming Chiao Tung ...