Dec 10, 2024 · DISCO CORPORATION, a semiconductor manufacturing equipment manufacturer (Head Office: Ota-ku, Tokyo; President: Kazuma Sekiya), has developed DKL7640, a fully automatic …

DISCO 8000 Series compatibility The DGP8761 is compatible with grinding wheels, polishing wheels, dresser boards and other parts designed for existing DISCO 8000 Series equipment.

DISCO's increasing size and complexity was the main reason for the introduction of the system. When a company is small, communication is fluid and most employees know each other.

DISCO Technical Review 與Kiru（切）・Kezuru（削）・Migaku（磨）技術相關的見解‧論文之頁面。

DISCO Technical Review 有关 Kiru（切）・Kezuru（削）・Migaku（磨）技术的见解和论文。

DISCO’s Definition of Growth as a Company In addition, DISCO does not think of growth in terms of the expansion of the company’s sales, size, or market share. For DISCO, “growth” as mentioned in …

Jul 3, 2023 · DISCO CORPORATION, a semiconductor manufacturing equipment manufacturer (Head Office: Ota-ku, Tokyo; President: Kazuma Sekiya), has used KABRA, an ingot slicing method using …

This is an ingot slicing method where a separation layer (KABRA layer) is formed at a specified depth by continuously irradiating an ingot with a laser, producing wafers starting from the KABRA layer. In …

Dec 12, 2023 · DISCO CORPORATION, a semiconductor manufacturing equipment manufacturer (Head Office: Ota-ku, Tokyo; President: Kazuma Sekiya), has developed DDS2020, a fully automatic …

Jul 5, 2023 · DISCO CORPORATION, a semiconductor manufacturing equipment manufacturer (Head Office: Ota-ku, Tokyo; President: Kazuma Sekiya), has opened a new mid-process research center …